TW_汽車電子封裝_Packaging Development Engineer (ASIC)

We are seeking a motivated, skilled, and curious Semiconductor Packaging Engineer to support the development of innovative, automotive-grade ASIC products. This role serves as a key bridge between internal cross-functional partners and external assembly/test suppliers (OSATs).

The ideal candidate combines technical packaging expertise with strong supplier management skills, a collaborative mindset, and a passion for continuous learning.

In this role, you will define, develop, and qualify robust packaging solutions. Your core tasks include:

• Package Design & Process Development: Drive design, material selection, and optimize assembly processes in close collaboration with external suppliers and internal cross-functional teams.
• Design & Risk Assessment: Participate in design risk reviews and Failure Mode and Effects Analyses (FMEAs) to mitigate assembly risks.
• OSAT & Supplier Management: Manage OSAT partners to overview manufacturing and processes, track project timelines, and ensure effective quality control.
• NPI & Process Qualification: Monitor prototyping runs and formal qualifications. Ensuring adherence to automotive standards (e.g., AEC-Q100, Q006).
• Global Collaboration: Act as the technical interface to align packaging and assembly requirements with international design, test, and quality management teams.

Technical Experience & Capabilities

• Education & Experience: Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or related disciplines, with 3+ years of experience in semiconductor packaging engineering.
• Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).
• Problem-Solving Skills : Strong analytical skills to work systematically to solve complex technical challenges. (e.g. 8D, statistic, etc…)
• Supplier Management: Proven ability to steer collaboration with external suppliers

Language & Travel Requirements

• Language Skills: Excellent English (verbal and written, min. C1 level) for international collaboration, paired with professional Mandarin Chinese for technical discussions with local teams and regional suppliers.
• Travel: Flexibility to travel to overseas supplier sites and OSAT manufacturing facilities according to project needs.